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技术能力 |
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项目/ltem |
批量/Mass Production |
样品／Prototype |
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表面处理 Surface Treatment |
喷锡(含无铅)/HASL(LF) |
喷锡(含无铅)/HASL(LF) |
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沉金／Immersion Gold |
沉金／Immersion Gold |
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电金／Flash Gold |
电金／Flash Gold |
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抗氧化／OSP |
抗氧化／OSP |
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沉锡／Immersion Tin |
沉锡／Immersion Tin |
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沉银／Immersion Silver |
沉银／Immersion Silver |
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喷锡+金手指/HASL&Gold Finger |
喷锡+金手指/HASL&Gold Finger |
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选择性镍金／selective nickel |
选择性镍金／selective nickel |
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喷锡(含无铅)厚度 |
PAD位／smt Pad：>3um |
PAD位／smt Pad：>4um |
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HASL(LF) |
大铜面／Big Cu：>lum |
大铜面／Big Cu：>l.5um |
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沉锡／Immersion Tin |
0.4-0.8um |
0.8-1.2um |
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沉金／Immersion Gold |
镍厚／Ni：2-5urn |
镍厚／Ni：3-6urn |
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金厚／Au:0.05-0.10um |
金厚／Au:0.075-0.15um |
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沉银／Immersion Silver |
0.2-0.6um |
0.3-0.6um |
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抗氧化／OSP |
0.1-0.4um |
0.25-0.4um |
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电金／Flash Gold |
镍厚／Ni：3-6urn |
镍厚／Ni：3-6urn |
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金厚／Au:0.01-0.05um |
金厚／Au:0.02-0.075um |
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板料／Laminates |
CEM-3、PTFE |
CEM-3、PTFE |
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FR一4(高Tg等)FR一4(HighTG etc) |
FR一4(高Tg等)FR一4(HighTG etc) |
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金属基板(铝，铜等)Metal Base(AL、CUetc) |
金属基板(铝，铜等)Metal Base(AL、CUetc) |
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Rogors、etc |
Rogors、etc |
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最大层数／MAX．Layers |
12(Layers) |
40(Layers) |
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最大版面尺寸／MAX.Board Size |
20"X48" |
20"X48" |
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板厚／Board Thickness |
O．4mm～6．0mm |
<O．4mm或>8．0mm |
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最大铜厚 |
内层／inner Layer：4oz |
内层／inner Layer：5oz |
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Max．Copper Thickness |
外层／Outer Layer：10oz |
外层／Outer Layer：10oz |
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最小线宽/Min.Track Width |
3mil／0．075mm |
3mil／0.075mm |
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最小线隙／Min．Track Space |
3mil／0．075mm |
3mil／0.075mm |
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最小钻孔孔径/M.in Hole Size |
8mil／0.2mm |
6mil／0.1mm |
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最小激光钻孔孔径/ |
4mil／0.1mm |
3mil／0.076mm |
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M．in Laser Hole Size |
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最小孔壁铜厚/ |
0.8mil／20um |
1.2mil／30um |
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PTH Wall Thickness |
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孔径公差/PTH Dia．Tolerance |
±2mil/±50um |
±2mil/±50um |
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板厚与孔径比/Aspect Ratio |
12:1 |
15:1 |
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阻抗控制/lmpedance Control |
±5% |
±5% |
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HDI技术能力参数 |
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项目Item |
批量Mass Produciton |
样品Prototype |
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HDI结构/HDI structure |
1+N+1/2+N+2/3+N+3 |
1+N+1/2+N+2/3+N+3/4+N+4 |
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埋孔Buried hole |
Filled |
Filled |
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(盲孔)厚径比 Aspect ratio |
0.75:1 |
1:1 |
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最小镭射孔 Minimum laser hole |
0.1mm 4mil |
0.1 4mil |
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最小镭射孔环 Minimum laser pad |
0.25mm 10mil |
0.25mm 10mil |
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盲孔 Blind hole |
No filled |
No filled |
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刚挠性板Rigid & Fled board |
YES |
YES |
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压接孔 Press fit hole |
YES |
YES |
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阶梯孔Control Depth drilling |
YES |
YES |
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无铅&无卤Lead-free&Halogen-free |
YES |
YES |
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沉金 Immersion Gold |
镍厚/Ni:2-5µm 金厚/Au:0.05-0.10µm |
镍厚/Ni:3-6µm 金厚/Au:0.075-0.15µm |
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沉锡 Immersion Tin |
0.6-1.2µm |
0.6-1.2µm |
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沉银 Immersion silve |
0.2-0.6µm |
0.3-0.6µm |
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抗氧化 OSP |
0.1－0.4µm |
0.25-0.4µm |
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喷锡（有铅&无铅）HASL(Sn-Pb&LF) |
PAD位/SMT Pad:>3µm 大铜面/Big Cu:>1µm |
PAD位/SMT Pad:>4µm 大铜面/Big Cu:>1.5µm |
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电金 Flash Gold |
镍厚/Ni:3-6µm 金厚/Au:0.01-0.05µm |
镍厚/Ni:3-6µm 金厚/Au:0.02-0.075µm |
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FPC工艺、工程能力 |
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项目Item |
常规 Routine |
特殊Special |
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层数 Layer |
1－6 |
6 floors above |
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生产板尺寸（最大）
Board Size(Max) |
①500mm×500mm
②100000mm×500mm (R-T-R) |
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生产板厚度
Board Thickness |
0.060mm—2.5mm |
4mm
(Flex-rigid Board) |
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CNC 钻孔孔径（最大）
CNC hole Size(Max) |
6.5mm |
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CNC 钻孔孔径（最小）
CNC Hole Size(Min) |
0.2mm |
0.15mm |
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CNC 钻孔孔径公差
CNC Hole Diameter Tolerance |
±0.025mm |
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CNC 钻槽长度与宽度最少比：
CNC Drilling Slot Length and Width Ratio |
2∶1 |
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孔电镀纵横比
Plating Aspect Ratio |
6∶1 |
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孔内铜厚
Hole(inner) Copper Thickness |
Min:10μm |
Max:38μm |
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焊盘镍厚
Bonding Pad Ni Thickness |
薄Thin/Ni:1～3μm
厚Thick/Ni:3～10μm |
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焊盘金厚（薄金） Bonding Pad Gold Thickness(Thin Gold) |
0.01-0.10μm |
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焊盘金厚（厚金）Bonding Pad Gold Thickness(Thick Gold) |
0.05-0.76μm |
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焊盘锡厚（镀锡）Bonding Pad Gold Thickness(plating Tin) |
1um-20um |
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抗氧化 Entek/O.S.P |
0.1um-0.4um |
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最小线宽/ 线距
Min Line Width/ Line Space |
0.075/0.075 mm |
0.05/0.05mm |
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蚀刻公差Etching Tolerance |
±20％( 最小公差Min Tolerance±0.03mm) |
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图形对图形精度
The Accuracy of Graphics to Graphics |
±3mil ( ±0.0762mm) |
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图形对孔位精度The Accuracy of Graphics to Holes |
±2mil ( ±0.0508mm) |
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覆盖膜对位公差 Cover Film Tolerance |
±8mil (±0.20 mm) |
±4mil(±0.10 mm) |
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冲孔机最大冲孔孔径Max Punching Aperture |
φ3.175mm |
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冲孔机最小冲孔孔径Min Punching Aperture |
φ2.0mm |
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冲孔机最大冲孔厚度Max Punching Thickness |
0.6mm |
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热固化油墨/UV 油墨位置公差Thermal Curable Ink/UV Ink Location Tolerance |
±0.2mm |
±0.15mm |
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绿油桥（最小）Green Oil Bridge( Min) |
0.1mm |
0.075mm |
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绿油到PAD （感光）Green Oil to PAD |
0.1mm |
0.075mm |
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绿油到SMT （感光）Green Oil to SMT |
0.1mm |
0.075mm |
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字符到PAD Character to PAD |
0.2mm |
0.15mm |
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字符到SMT Character to PAD |
0.2mm |
0.15mm |
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最小电测试焊盘
Min Electrical Test Pads |
8mil X 8mil |
6mil X 6mil |
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最小电测试焊盘距离
Min Distance of Electrical Test Pad |
8mil |
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外形尺寸最小公差（边到线）Outline Dimensions Min Tolerance(Edge-to-Line) |
±0.15mm |
±0.125mm |
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手指边间距
Finger Edge Spacing |
±0.15mm |
±0.125mm |
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外形尺寸最小公差
Outline Dimensions Min Tolerance |
±0.1mm |
±0.05mm |
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外形最小R 角半径（内圆角）
Min R Angular Radius (Filleted Corner) |
0.2mm |
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最小冲孔孔径
Min Punching Aperture |
φ0.5mm |
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